StegX is proud to announce its selection to represent Germany at Hong Kong FinTech Week 2025, joining the official German Pavilion organized by the German Industry and Commerce Ltd. (GIC) Hong Kong, in cooperation with Germany Trade & Invest (GTAI) and StartmeupHK.
This year marks the 10th anniversary of one of the world’s leading fintech events, bringing together more than 37,000 attendees, 800+ global speakers, and 700+ exhibitors from over 100 economies. From 3–7 November 2025, the Hong Kong Convention and Exhibition Centre will host a week of innovation, networking, and insights focused on the future of financial services, digital assets, and global collaboration.
As part of the German Pavilion, StegX will showcase its institutional marketplace ecosystem for tokenized real estate and structured finance, highlighting how blockchain and regulated digital infrastructure are reshaping global investment markets. Representing Germany alongside a strong lineup of fintech and technology innovators, StegX will engage with investors, policymakers, and industry leaders to explore the next generation of compliant, efficient, and transparent market solutions.
“Being selected to join the official German delegation at Hong Kong FinTech Week underscores our mission to connect institutional investors and real estate managers through trusted digital solutions,” said Daniel Radwansky, CEO and Co-Founder of StegX. “We see Hong Kong as a key hub for cross-border innovation and are excited to contribute to the dialogue shaping the digital future of finance.”
StegX extends its appreciation to the organizers and partners for enabling this opportunity to represent Germany on a global stage. The team looks forward to an inspiring week of collaboration and exchange with the international fintech community.
📍 Booth [5F-CA10], Hong Kong Convention and Exhibition Centre
📅 3–7 November 2025
Stay connected with StegX for updates throughout the event and insights into our ongoing initiatives to build a global ecosystem for tokenized real assets.
